Read e-book online Design for High Performance, Low Power, and Reliable 3D PDF

By Sung Kyu Lim

This booklet presents readers with quite a few algorithms and software program instruments, devoted to the actual layout of through-silicon-via (TSV) established, third-dimensional built-in circuits. It describes a number of “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs constructed with the instruments coated within the booklet. This publication also will characteristic sign-off point research of timing, strength, sign integrity, and thermal research for 3D IC designs. complete info of the similar algorithms should be supplied in order that the readers should be capable not just to understand the middle mechanics of the actual layout instruments, but additionally as a way to reproduce and enhance upon the implications themselves. This e-book also will provide a number of design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) strategies which are thought of severe to the actual layout process.

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim

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