By Madhavan Swaminathan,Ki Jin Han
3D Integration is being touted because the subsequent semiconductor revolution. This publication presents a accomplished assurance at the layout and modeling features of 3D integration, in relatively, concentrate on its electric habit. taking a look from the point of view the Silicon through (TSV) and Glass through (TGV) expertise, the booklet introduces 3DICs and Interposers as a know-how, and offers its program in numerical modeling, sign integrity, strength integrity and thermal integrity. The authors underscored the opportunity of this know-how in layout trade codecs and gear distribution.
- System Integration and Modeling Concepts
- Modeling of Cylindrical Interconnections
- Electrical Modeling of via Silicon Vias
- Electrical functionality and sign Integrity
- Power Distribution, go back course Discontinuities and Thermal Management
- Alternate tools for energy Distribution
Readership: Graduate scholars, lecturers, researchers in electric and electronics engineering, machine engineering, semiconductors and packaging.
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Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging) by Madhavan Swaminathan,Ki Jin Han